ACT-3100C

ACT-3100C Online Planar CT Inspection Equipment

Product Features:
High-Precision High-Speed Linear Motor System
Guarantees high inspection efficiency and positioning accuracy for samples.
High-Definition Navigation Camera
Delivers precise repeatability for sample positioning.
High-Resolution Flat Panel Detector
Achieves inspection accuracy up to 8 μm for CT mode and 4 μm for DR mode.
High-Precision Vertical Gantry Mechanism
Enables an inspection throughput of 4 seconds per field of view (FOV).
AI-Powered Image Enhancement Algorithm
Effectively improves the signal-to-noise ratio (SNR) of scanned images.
Product Introduction:

The ACT-3100C is an inline planar CT system developed by X3000 Inspection for rapid CT scanning, reconstruction and analysis of SMT/THT soldering, IGBT module packaging and related applications.

Powered by proprietary high-speed CT imaging algorithms and a precision marble motion platform, the system reduces the number of required DR projections to significantly improve CT scanning efficiency.

Custom deep learning-based recognition algorithms achieve a defect identification accuracy of over 99% for voids, solder climbing height, foreign contaminants and other typical flaws.This system is widely applied to electronic products with SMT/THT soldering processes, IGBT modules and a full range of automotive electronic assemblies.

Applicable fields:

◈ Automotive Electronics Inspection

Verifies structural integrity, interconnection status and other critical internal defects of automotive electronics and IGBT power modules.

◈ PCB Inspection

Focuses on PCB back-drilling quality inspection including inner-hole residues and aperture dimensional accuracy to prevent abnormal circuit signal transmission.

◈ Package Substrate Inspection

Specialized in detecting internal traces, solder joints and structural defects of package substrates to guarantee the fundamental reliability of chip packaging.

Parameter Introduction:
    CategoryItemParameter
    Imaging SystemSystem Maximum Resolution4μm/10μm
    Inspection Mode2D & 3D
    Software
    Self-developed software by X3000 Inspection (Customizable for diverse requirements), Volume Graphic (Optional)
    X-ray SourceTube TypeSealed Tube
    Tube Voltage130kV/180kV
    Focal Spot Size8μm/20μm
    DetectorDetector TypeFlat Panel Detector
    Pixel Size49.5μm
    Pixel Matrix2352×2944
    Motion Control SystemX-ray Source TravelX-axis: 1000mm; Y-axis: 1100mm
    Detector TravelX-axis: 1000mm; Y-axis: 1200mm
    Stage TravelZ-axis: 200mm
    Board Loading ModeLeft In Left Out, Left In Right Out, Right In Left Out, Right In Right Out
    Compatible Product Thickness0.4mm–5mm (Customizable)
    Maximum Inspection Range600mm×600mm (Customizable)
    Maximum Component HeightTop: 50mm, Bottom: 50mm (Customizable)
    Allowable Board Warpage≤3mm
    Maximum Load Capacity10KG (Customizable)
    Overall Specifications
    Overall DimensionL:2000mm W:2000mm H:1700mm (Excluding three-color warning light, subject to final design)
    Net WeightApprox. 3500KG
    Rated PowerApprox. 8kW (Subject to final design)