ACT-3100A

ACT-3100A Online X-Ray Inspection Equipment

Product Features:
◈ High-Precision Navigation System
Enables precise and convenient positioning of inspected samples.
◈ 0.5μm Ultra-High Resolution X-ray Source
Supports sub-micron level defect detection for ultra-fine flaw identification.
◈ High-Precision Multi-Axis Rotation System
Provides high-degree-of-freedom movement to support multi-angle product inspection.
◈ Oversized Inspection Platform
Accommodates defect detection for large-sized products up to 550mm×550mm.
Product Introduction:

ACT-3100A is a CT system independently developed by X3000 Inspection for fast, high-precision X-ray and CT scanning reconstruction of large-size flat products including advanced packaging components such as wafer-level packaging, panel-level packaging, and TGV glass substrates, serving as a direct alternative to the Q-series products of a certain imported brand.

Equipped with self-developed high-performance CT reconstruction algorithms and a high-precision marble motion platform, the system enables CT imaging with a resolution up to 1 micron.

In addition, the equipment can be integrated with a customized wafer and chip handling system to support automatic or semi-automatic inspection workflows.

Applicable fields:
◈ SMT Inspection
Focuses on void ratio detection of BGA, QFN and other core mounted components, covering typical solder joint defects.
◈ Chip Packaging Inspection
Covers packaging forms including CSP, QSP, PGA and SOP to identify various packaging-related defects.
◈ DIP Inspection
Targets PTH solder climbing height and bonding wire breakage issues, ensuring the reliability of through-hole packaging.
◈ Automotive Electronics Inspection
Detects defects in automotive electronic components and IGBT power modules.
◈ Advanced Packaging Inspection
Covers key defects of advanced packaging forms such as TGV, TSV, wafer-level packaging and panel-level packaging.
Parameter Introduction:
    CategoryItemParameter
    Imaging SystemCT System Resolution≥1μm
    DR System Resolution0.25μm/0.45μm
    Inspection Mode2D & 2.5D & 3D
    SoftwareSelf-developed software by Gongyuansanqian (Customizable for diverse requirements)
    Volume Graphic (Optional)
    X-ray SourceTube TypeOpen Transmission Tube
    Tube Voltage160kV
    Focal Spot Size0.5μm/0.9μm
    DetectorDetector TypeFlat Panel Detector
    Pixel Size49.8μm
    Pixel Matrix2340×2813
    Motion Control SystemInspection Range510mm×515mm (Customizable)
    Automatic NavigationRecords coordinate positions and parameters of feature points to enable fast movement to inspection positions
    Control ModeMouse, Keyboard, Joystick, Software
    Scanning Motion Mode2×70°, 360° orbital rotation inspection for test points
    Overall SpecificationsOverall DimensionL:1591mm W:1560mm H:2012mm (Excluding three-color warning light, subject to final design)
    Net WeightApprox. 3500KG
    Rated PowerApprox. 8kW (Subject to final design)