ACT-3100A

ACT-3100A Online X-Ray Inspection Equipment

Product Features:
High-Precision Navigation System
Enables precise and convenient positioning of inspected samples.
0.5μm Ultra-High Resolution X-ray Source
Supports sub-micron level defect detection for ultra-fine flaw identification.
High-Precision Multi-Axis Rotation System
Provides high-degree-of-freedom movement to support multi-angle product inspection.
Oversized Inspection Platform
Accommodates defect detection for large-sized products up to 550mm×550mm.
Product Introduction:

ACT-3100A is a CT system independently developed by X3000 Inspection for fast, high-precision X-ray and CT scanning reconstruction of large-size flat products including advanced packaging components such as wafer-level packaging, panel-level packaging, and TGV glass substrates, serving as a direct alternative to the Q-series products of a certain imported brand.

Equipped with self-developed high-performance CT reconstruction algorithms and a high-precision marble motion platform, the system enables CT imaging with a resolution up to 1 micron.

In addition, the equipment can be integrated with a customized wafer and chip handling system to support automatic or semi-automatic inspection workflows.

Applicable fields:
SMT Inspection
Focuses on void ratio detection of BGA, QFN and other core mounted components, covering typical solder joint defects.
Chip Packaging Inspection
Covers packaging forms including CSP, QSP, PGA and SOP to identify various packaging-related defects.
DIP Inspection
Targets PTH solder climbing height and bonding wire breakage issues, ensuring the reliability of through-hole packaging.
Automotive Electronics Inspection
Detects defects in automotive electronic components and IGBT power modules.
Advanced Packaging Inspection
Covers key defects of advanced packaging forms such as TGV, TSV, wafer-level packaging and panel-level packaging.
Parameter Introduction:
    CategoryItemParameter
    Imaging SystemCT System Resolution≥1μm
    DR System Resolution0.25μm/0.45μm
    Inspection Mode2D & 2.5D & 3D
    SoftwareSelf-developed software by Gongyuansanqian (Customizable for diverse requirements)
    Volume Graphic (Optional)
    X-ray SourceTube TypeOpen Transmission Tube
    Tube Voltage160kV
    Focal Spot Size0.5μm/0.9μm
    DetectorDetector TypeFlat Panel Detector
    Pixel Size49.8μm
    Pixel Matrix2340×2813
    Motion Control SystemInspection Range510mm×515mm (Customizable)
    Automatic NavigationRecords coordinate positions and parameters of feature points to enable fast movement to inspection positions
    Control ModeMouse, Keyboard, Joystick, Software
    Scanning Motion Mode2×70°, 360° orbital rotation inspection for test points
    Overall SpecificationsOverall DimensionL:1591mm W:1560mm H:2012mm (Excluding three-color warning light, subject to final design)
    Net WeightApprox. 3500KG
    Rated PowerApprox. 8kW (Subject to final design)