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Application Scenarios

Electronics Manufacturing

Industrial X-Ray CT technology enables non-destructive testing of electronic manufacturing products. It comprehensively detects critical process defects including internal cracks/foreign objects in electronic components, BGA open soldering, cold soldering, insufficient solder wetting, and incomplete solder balls in chip packaging, ensuring effective product reliability assurance.
When inspecting defects in advanced packaging products, the technology delivers micron-level resolution imaging, cle

  • FPCA
  • PCBA
  • Power Semiconductors
Detecting Images
  • Solder Missing
  • BGA
Product Line - Semiconductor Series X-Ray Equipment
AXI-3100

AXI-3100 Online X-Ray Inspection Equipment

AXI-3100

Group Headquarters:：Quzhou City, Zhejiang Province

R&D Center：Wuxi City, Jiangsu Province

Production Bases：Wuhu City(Anhui), Yancheng City(Jiangsu)

Test Base：Chengdu City, Sichuan Province

+86 152-5150-5981

jerry@3000gy.com

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